ANSYS Acquires Helic, an Electromagnetic Crosstalk Solutions Provider

Acquisition will complement ANSYS' portfolio to enable next-generation products in 5G and artificial intelligence.

Acquisition will complement ANSYS' portfolio to enable next-generation products in 5G and artificial intelligence

ANSYS has entered into a definitive agreement to acquire Helic, provider of electromagnetic crosstalk solutions for systems on chips (SoCs). The acquisition of Helic, combined with ANSYS' flagship electromagnetic and semiconductor solvers, will provide a solution for on-chip, 3D integrated circuit and chip-package-system electromagnetics and noise analysis, according to ANSYS.

The transaction is expected to close in the first quarter of 2019. Management will provide further details regarding the transaction and its impact on the 2019 financial outlook after the closing.   

Helic's solutions reportedly help top semiconductor companies debug and analyze electromagnetic crosstalk issues in their advanced SoC designs and reduce the risk of silicon failure. When combined with ANSYS' solutions for electromagnetics and power-integrity noise analysis, engineers can deploy an electromagnetic-aware design methodology to design devices in all advanced nodes, optimize the die size and precisely capture electromagnetic and parasitic effects from direct current up to 110 GHz. 

Its product suite includes electromagnetic modeling and simulation for complex circuits for sub-10 nanometer technologies. Helic products have been deployed by worldwide customers in applications ranging from radio-frequency wireless transceivers, graphics processing units, high-speed I/Os in multi-core processors and image sensors and other Internet of Things connected devices.

“Electromagnetic noise is a key design challenge that is driving the need for extensive on-chip electromagnetic analysis,” says John Lee, ANSYS vice president and general manager. 

“Helic is thrilled to become part of the ANSYS family. This acquisition will bring significant benefits to both ANSYS and Helic customers,” says Yorgos Koutsoyannopoulos, president and CEO of Helic. “ANSYS customers will gain easy access to on-chip electromagnetics solvers, integrated with the flagship ANSYS electronics and semiconductor tools. Helic customers will benefit from inclusion in the ANSYS platform for multi-physics and chip-package-system.”

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Sources: Press materials received from the company and additional information gleaned from the company’s website.

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