DE Editors

DE's latest posts

• Editor’s Pick: Tap Into More Powerful Simulation of Coupled Multiphysics Phenomena 
  November 20, 2019
  New features in COMSOL Multiphysics Version 5.5 include simplified shape and topology optimization; new options for nonlinear shell analysis; a new interface for pipe mechanics; and more.
• Editor’s Pick: Automate New Design Space Workflows
  November 13, 2019
  nTop Platform 2.0 designed to help engineers design high-performance parts faster.
• Editor’s Pick: Removing Bottlenecks From Sharing Simulation Results 
  November 6, 2019
  VCollab merges information from multiple CAE and CAD sources into a single 3D file.
• Editor’s Pick: 500,000 Colors Produced From One 3D Printer
  October 30, 2019
  Stratasys J850 3D printer and the new materials released with it advance use of 3D printing throughout the design process.
• Editor’s Pick: Tap Into More Powerful Simulation of Coupled Multiphysics Phenomena 
  November 20, 2019
  New features in COMSOL Multiphysics Version 5.5 include simplified shape and topology optimization; new options for nonlinear shell analysis; a new interface for pipe mechanics; and more.
• AMD Launches 7nm Professional PC Workstation Graphics Card
  November 20, 2019
  AMD Radeon Pro W5700 graphics card harnesses high-performance AMD RDNA architecture, process technology and enterprise-grade software to help professionals increase productivity and more.
• Identify3D and Siemens Digital Industries Software Sign OEM Partnership Agreement
  November 20, 2019
  Both companies can help support automated, end-to-end, secure and controllable manufacturing data distribution, collection and monitoring across control systems and production equipment.
• OpenBOM Debuts Enhanced CAD Integrations with Autodesk Fusion 360 and Launches Autodesk Eagle Plug-in
  November 20, 2019
  OpenBOM offers capabilities to manage Parts, Bill of Materials, Vendors and Purchase Orders and streamlining design to purchase process for engineering prototyping teams and small-to-medium sized manufacturing companies.
• GE Additive Unveils Arcam EBM Spectra L Printer at Formnext
  November 20, 2019
  Company also announces new Concept Laser M2 Series 5, powder recovery station, support for new materials.
• NASA Buys Third nScrypt Factory in a Tool to Print Conductive Materials
  November 20, 2019
  Creating 3D antennas and printing conformal antennas on non-flat surfaces are reportedly the top objectives of the NASA research project.
• Dyndrite Unveils New GPU-Powered, Python-Scriptable, AM Build Processor
  November 20, 2019
  New application brings performance improvements and native CAD-to-print capabilities to additive manufacturing technicians.
• Siemens Acquires MultiMechanics
  November 20, 2019
  Siemens to integrate MultiMechanics' TRUE Multiscale simulation technology with Simcenter 3D software to accelerate innovation and adoption of advanced materials, company says.
• Autodesk and ANSYS to Team Up to Increase Interoperability
  November 19, 2019
  The collaboration connects Autodesk Fusion 360 design and manufacturing software with ANSYS Mechanical simulation solutions, according to the companies.
• Bright Computing Makes Bright Cluster Manager Software Free for Clusters Up to 8 Nodes
  November 19, 2019
  Bright is making Bright Cluster Manager widely available through the Easy8 program. 
• DWS and Huntsman Form Cooperation to Bring Resin to Market
  November 19, 2019
  The collaboration will give footwear companies and other industrial manufacturers access to the SLA 3D printing of a new kind of polyurethane-based resin.
• Mastercam Launches Signature Parts Series for Manufacturing Community
  November 19, 2019
  The series was initiated to showcase how Mastercam works throughout the manufacturing process using realistic parts.
• BASF 3D Printing Solutions Exhibits Industrial AM Solutions at Formnext
  November 18, 2019
  Forward AM is the company’s new brand name.
• BigRep Expands Specialized Large-Format Materials Portfolio
  November 18, 2019
  The new materials—PLX, PET-CF, PA6/66 and BVOH—help support BigRep’s mission to provide environmentally-friendly engineering-grade materials to large-format additive manufacturing.
• EUROCOM Sky X4C Mobile Supercomputer Features Intel Core Special Edition Processor
  November 18, 2019
  Combined with 16-way multitasking support powered by eight cores via Intel Hyper-Threading Technology, the Intel i9-9900KS Special Limited Edition can help users handle demanding workloads.
• Y Soft Launches be3D Academy
  November 15, 2019
  Teacher-tested lesson plans in STEAM subjects designed to aid classroom instruction and immersive learning.