
DE’s editors contribute news and new product announcements to Digital Engineering.
Press releases may be sent to them via DE-Editors@digitaleng.news.
Have suggestions or something you want to read about? Email DE at de-editors@digitaleng.news
DE's latest posts
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Editor’s Pick: Print metal on plastics printer
June 29, 2022Ultimaker Metal Expansion Kit for Ultimaker S5 enables a switch between thermoplastic and metal printing. -
New Programmable, Expanding Foam Polymer
June 24, 2022Desktop Metal FreeFoam enables heat-activated 3D printing of foam parts. -
E-CAD Tool Streamlines PCB Design
June 24, 2022Newest release of eCADSTAR includes new model management library, semi-automatic routing.
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New Ansys Tools Improve Semiconductor Design
June 23, 2022Ansys Totem-SC and PathFinder-SC optimize power and reliability for automotive, 5G, and high-performance compute semiconductors. -
Editor’s Pick: Print metal on plastics printer
June 29, 2022Ultimaker Metal Expansion Kit for Ultimaker S5 enables a switch between thermoplastic and metal printing.
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Unearthing New Features in Simcenter FLOEFD 2205
June 28, 2022Part of the features included in the latest release include multiphysics capabilities in structural analysis.
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Young Designers Across Globe Picked for WDO Program
June 28, 2022The 21 young designers will collaborate over the next 18 months on a variety of international projects and events.
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Rensselaer Polytechnic Sets Up Institute for Advanced Computing
June 27, 2022DAIC plans to innovate quantum computing and edge computing for cyberphysical systems, and hacker-proof quantum communications.
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Small but Power-Packed Desktop Workstation
June 27, 2022ThinkStation P360 Ultra houses latest Intel Core processor, Nvidia RTX A5000 GPU, support for eight monitors.
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Siemens’ NX Delivers Cross-Discipline Collaboration
June 27, 2022Part of the Siemens Xcelerator portfolio of software and services, NX delivers productivity and user-experience enhancements, the company reports.
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Collins Aerospace Opens Additive Manufacturing Center
June 27, 2022The company also expands maintenance, repair and operations capabilities.
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Editor’s Picks: June 15-24, 2022
June 27, 2022One of the picks will be chosen as DE’s Editor’s Pick of the Week.
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New Programmable, Expanding Foam Polymer
June 24, 2022Desktop Metal FreeFoam enables heat-activated 3D printing of foam parts.
-
E-CAD Tool Streamlines PCB Design
June 24, 2022Newest release of eCADSTAR includes new model management library, semi-automatic routing.
-
New Ansys Tools Improve Semiconductor Design
June 23, 2022Ansys Totem-SC and PathFinder-SC optimize power and reliability for automotive, 5G, and high-performance compute semiconductors.
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Prototek Acquires 3D Printing Company
June 23, 2022Acquisition will expand additive manufacturing capabilities.
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Ultimaker Offers Metal Expansion Kit
June 23, 2022Users can efficiently switch between printing plastic and metal on one 3D printer.
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Creaform Launches VXelements 10
June 23, 2022A new cloud licensing system has been implemented to facilitate license sharing between users of a given company.
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Hexagon Announces Nexus for Smart Manufacturing
June 23, 2022Nexus will enable real-time data sharing between different design, simulation and production applications.
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EnSuite-Cloud ReVue Launches 1-click Experience Center
June 23, 2022Whenever there is a need to review 2D/3D CAD data in the product development process, ReVue provides a secure platform for collaboration with your team or suppliers, the company reports.
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All posts
Editors’ Picks

Editor’s Pick: Print metal on plastics printer
Ultimaker Metal Expansion Kit for Ultimaker S5 enables a switch between thermoplastic...

Editor’s Pick: Accelerating lattice generation
nTopology third generation update features fundamental rewrites to its core software, which...

Editor’s Pick: Manage rapid prototyping in model-based engineering
ADEPT industrial IoT software platform is a data framework that links real-time...

Editor’s Pick: Improve file editing for 3D prints
Now released is Materialise Magics 26, software for 3D printing file preparation.