Intelligent Computing for Digital R&D

Rescale’s Software-Defined Approach to Modernizing Science and Engineering Computing

IT teams have pushed storage and networking from legacy inflexible and inefficient models to a much more dynamic and agile management model. Core to this evolution has been the advent of software-defined data centers, which separate managing logical resources from the underlying physical infrastructure. This trend has dramatically reshaped storage and networking infrastructure, and now Software-Defined Computing (SDC) is emerging as a major force in scale-out, compute-intensive applications. Software-Defined Computing first changed the data center 15 years ago with the advent of server virtualization, and now is redefining how science and engineering’s R&D applications and workflows are accelerated and optimized in the enterprise.

Rescale’s intelligent software-defined computing approach transforms static hardware power into a dynamic resource that enables automation and simplified, rapid deployment for large-scale applications. With SDC, both line of business and IT managers can better match their needs to available compute resources without a need to understand the complexity of the underlying hardware. By combining SDC with workload intelligence, IT organizations can abstract and automate complex hardware decisions and configurations for their end users. This enables them to efficiently drive digital transformation initiatives and take advantage of the best and latest hybrid and multi-cloud technologies for each specific application. 

In this white paper, we present the core ideas and new trends in Software-Defined Compute, and how Rescale automates SDC for IT and HPC organizations.

Fill out the information below to download the resource.

By downloading this content, I agree to receive the DE 24/7 Newswire, a twice weekly free email newsletter (you may choose to opt-out in the newsletter).

Latest News

Autodesk Accelerate: Lessons on Transformation from the Big Easy
At Autodesk Accelerate Conference, Autodesk executives and customers discuss digital transformation.

EOS and Sauber Technologies Sign 3-Year Additive Partnership
Signed at the Formula 1 Grand Prix in Barcelona, the partnership will enable solutions for F1 and beyond, companies report.

Call for Entries for 2022 Die Casting Competition
The deadline is June 13, 2022.

Desktop Metal Launches DuraChain Photopolymers
DuraChain photopolymers deliver elastic, tough material properties for digital light processing printing through a photopolymerization separation process.

All posts