The Future of Engineering Computing at the Design & Simulation Summit

As engineering workflows and models become larger and more complex, designers need access to more compute power than ever before. At the virtual 2023 Design & Simulation Summit on Oct. 26, attendees can learn how to select the right options – workstations, HPC, or cloud – for their specific workflows. In a session titled The Future of Engineering Computing: From Workstations to the Cloud, MingYao Ding, principal and vice president of engineering at Ozen Engineering, will explain how GPUs have revolutionized simulation performance, and what options are available in terms of workstations and cloud solutions for accelerating these workflows.

The Design & Simulation Summit, presented by Digital Engineering, kicks off at 1 pm Eastern on Oct. 26 with a keynote panel titled What Can AI Bring to Design for Additive Manufacturing? Following the keynote, attendees can select from four additional presentations on Design, Simulation, Digital Thread, and Engineering Workstations presented by leading end users, analysts and consultants.

According to the session description: 

A massive change is underway in the way we do engineering computing driven by engineering software enhancements, powerful GPUs and Cloud services.

When properly supported, the current generation of workstation-grade GPUs can match the performance of a compute cluster available just a few years ago. At the same time, commercial cloud offerings now provide easy access to vast amounts of CPU, GPU and RAM. This makes it possible to achieve unprecedented efficiency in engineering computing.

In this presentation we will discuss how to choose the right workstation, GPU and cloud computing resources, and share metrics on the speed and efficiency that can be achieved with the current generation of workstation and cloud hardware.

You can learn more about the Engineering Computing session here, and register at this link.