Sponsored Content
Solving The Toughest Engineering Challenges With HPC
June 5, 2019
Migrating to the cloud can enable engineers and scientists to remove engineering bottlenecks and quicken optimization cycles, providing design simulation results nearly instantly.
Sponsored Content
Taking a Cloud-Based Approach to Computer-Aided Engineering
June 5, 2019
In this Q&A, Dr. Masha Petrova, VP of marketing at OnScale, talks about her company’s cloud-based methodology for solving problems, the 5G arena, and more.
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Hitting at the Hidden (and Not So Hidden) Costs of CAE
June 3, 2019
Today’s engineers use Computer Aided Engineering (CAE) software to solve a range of engineering problems associated with the mass production of products.
Latest News
BASF 3D Printing Solutions Exhibits Industrial AM Solutions at Formnext
Forward AM is the company’s new brand name.
BigRep Expands Specialized Large-Format Materials Portfolio
The new materials—PLX, PET-CF, PA6/66 and BVOH—help support BigRep’s mission to provide environmentally-friendly engineering-grade materials to large-format...
EUROCOM Sky X4C Mobile Supercomputer Features Intel Core Special Edition Processor
Combined with 16-way multitasking support powered by eight cores via Intel Hyper-Threading Technology, the Intel i9-9900KS Special Limited...
Y Soft Launches be3D Academy
Teacher-tested lesson plans in STEAM subjects designed to aid classroom instruction and immersive learning.
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Editors’ Picks
Editor’s Pick: Automate New Design Space Workflows
nTop Platform 2.0 designed to help engineers design high-performance parts faster.
Editor’s Pick: Removing Bottlenecks From Sharing Simulation Results
VCollab merges information from multiple CAE and CAD sources into a single ...
Editor’s Pick: 500,000 Colors Produced From One 3D Printer
Stratasys J850 3D printer and the new materials released with it advance...
Editor’s Pick: A Fresh Take on Industrial Design Software
Altair Inspire Studio is part of Altair’s Inspire Platform, a set...