Digital Engineering, February 2019

Our February coverage focuses on how 5G, digital twins and the internet of things are bringing the digital thread together.


Image courtesy of Getty Images/gogoloji

Inside this issue

Connecting the Thread: 5G

5G wireless may bring benefits to cloud-based CAD, IoT, simulation and digital twins.

Connecting the Thread: Digital Twins

A factory floor digital twin can deliver insights to design engineers, but it takes some legwork to create a closed loop workflow between manufacturing and engineering.

Connecting the Thread: IoT

Commercial sector of IoT can use some templates for implementation, but most designers delve into unknown territory.

Striving for Zero

Reducing, or even eliminating, the use of physical prototypes can yield tremendous benefits. The question is: How do you proceed?

AR Added to Driverless Car Testing

Researchers make the case for a hybrid autonomous vehicle test process that combines simulated vehicles and traffic scenarios with real-world test drives.

Ruggedized Electronics Require Special Attention

The challenge of designing sensitive electronics for harsh environments.

Walkthrough: ANSYS Workbench 19.2

Take a hands-on look at how the ANSYS Workbench environment is used to explore the physics of a benchmark model.

Licensed to See

Ophthalmology startup uses a parametric digital eye model to develop presbyopic treatments.

Simulating Humans

HPC-backed in silico simulation could fuel the next revolution in clinical studies and treatment development.

ZW3D Review: Model Manufacture

ZWSOFT updates its all-in-one CAD/CAM program.

Finalists Compete to Enable Mobility

Toyota Mobility Foundation, in partnership with Nesta’s Challenge Prize Centre, has announced finalists in the $4 million global Mobility Unlimited Challenge.

Lenovo ThinkStation P520: Affordable Power

We review the latest mainstream Lenovo tower workstation.

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Latest News

Siemens and ASME Announce Innovate for Impact: Siemens Design Challenge Winners
Teams from Colombia, Uganda and the U.S. selected for innovations that meet need for clean water and adequate food...

AMD COVID-19 HPC Fund Adds 18 Institutions and Five Petaflops of Processing Power
AMD EPYC CPUs and Radeon Instinct GPUs to power COVID-19-related research at Stanford School of Medicine, the University of...

Team Penske and Stratasys Extend Technical Partnership
Team Penske has expanded its use of Fused Deposition Modeling and PolyJet Technologies for prototyping, tooling, fixturing and end-use parts...

Rescale and Hyundai Motor Group Team Up to Boost Mobility Innovation
Companies build a multi-cloud high-performance computing environment.

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