July 15, 2020
The new Ansys 2020 R2 release boasts enhanced solving and collaboration capabilities. According to the company, these new tools “help engineering teams develop new products, sustain business continuity, improve productivity and win the race to market.”
“Simulations that were taking us over a week to run are now being completed in less than two days,” said Benjamin Steinhaus, Engineering Director, Coca-Cola Freestyle, The Coca-Cola Company. “Overnight simulations are now being done in an hour. By using the Ansys Cloud™ system that was provided to us, our team has actually increased productivity during COVID.”
According to the company, Ansys 2020 R2 helps engineering teams accelerate innovation in any environment and create innovative designs by harnessing new workflows and dynamic capabilities across Ansys’ flagship suites. Updates in Ansys Cloud offerings, such as virtual desktop infrastructure support, unite Ansys’ simulation solutions with highly scalable compute power delivered by cloud-based HPC. Platform solutions enhanced with improved workflows deliver a streamlined user experience with enhanced functionality for data and configuration management, dependencies visualization and decision support, as well as user-friendly workflows for process integration and design optimization and materials management. Ansys’ digital twin solutions enable remote monitoring of assets and are a critical component for predictive maintenance.
Ansys 2020 R2 can also drive autonomous vehicle (AV) development and validation with new technologies ranging from advanced LiDAR models to a new sky model for enhanced daylight simulation that extends camera hardware-in-the-loop use cases to daytime. It also provides a complete New Car Assessment Program (NCAP) scenario kit for AV function development, enabling rapid simulation of standard NCAP testing scenarios, potentially reducing the cost of physical testing by 50% as advanced driver assistance systems increase in vehicles.
“Ansys’ optical and simulation solutions empower Weldex Corporation to render our engineering innovations into visual material,” said William Jung, CEO, Weldex Corporation. “We are able to import optical simulation results of headlamps from Ansys SPEOS to Ansys VRXPERIENCE Headlamp and use scenarios created in Ansys VRXPERIENCE Driving Simulator powered by SCANeR to create movies of driving vehicles equipped with our products’ virtual prototypes. We use the results to facilitate post-processing and data visualization for lamp certification, replacing costly and difficult night tests. These tools also give us a real competitive advantage to demonstrate our high-quality, durable automotive illumination solutions to our customers through lifelike and reliable pictures and videos.”
Additionally, Ansys 2020 R2 improves deployment, scalability and performance of AI-based perception software testing through multi-GPU parallelization, making it easy to systematically identify hazards and comply with new safety standards like Safety of the Intended Functionality (SOTIF).
“NXP is in process of deploying Ansys medini analyze internally as the recommended tool to perform quantitative safety analyses. Several valuable tool improvements have been identified and implemented over the last years of collaboration, for example, related to distinction between transient and permanent faults and import and allocation of design data,” said Dr. Rolf Schlagenhaft, senior automotive functional safety professional and assessor, NXP Semiconductors Germany GmbH. “The number of NXP projects which use medini are increasing. The collaboration between NXP and medini continues with a focus on easy configurability of generic safety analyses to specific customer use cases by field application engineers.”
In support of automotive electrification, a new thermal and vibrational analysis coupled with Ansys’ industry-leading electromagnetic field simulation software helps predict reliability and noise, vibration and harshness, the company says. Additionally, modeling thermal behavior of batteries during all stages of the design cycle is now easier via a streamlined workflow and new capabilities that simulate the important effects of capacity fade and cell life.
Supporting 5G, Ansys 2020 R2 advances phased array antenna analysis to enable engineers to simulate larger, more complex designs with scalable leveraging of HPC. Additionally, engineers may leverage significant advances for integrated circuit (IC), package and board workflows, enabling electronics reliability and electrothermal modeling. Lastly, on-chip device modeling combined with 3D electromagnetic simulation software provides gold standard verification for sensitive ICs.
Sources: Press materials received from the company and additional information gleaned from the company’s website.
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